Data Center & Al
SolutionsData Center & Al

Next-Gen Cooling for Next-Gen AI Chips

Key Challenges
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    Addressing extreme heat loads ( 300W to 2500W+ per GPU )

  • 02

    Supporting ultra-high rack densities ( 200kW+ per rack )

  • 03

    Meeting aggressive PUE targets ( <1.05 )

  • 04

    Ensuring reliability for your most temperature sensitive workloads

  • 05

    Managing variability in workloads and heat generation

ARA's Approach

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    Comprehensive Portfolio

    From targeted D2C solutions to prefabricated cooling stations, we provide optimised cooling to fit all AI infrastructure requirements.

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    Adaptive Performance

    Our systems respond dynamically to varying workloads, maintaining optimal chip temperature ( ± 1°C ) during both training and inference cycles.

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    Energy Efficiency:

    ARA's two-phase solutions can run on 45°C inlet water, dramatically decreasing your PUE and WUE figures and reducing operational costs and environmental impacts.

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    Maximum Uptime:

    Our systems are built to stay running. Redundant designs and high quality components, coupled with built-in comprehensive monitoring ensure that no time is lost dealing with problems.

ARA's Solutions
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    High-performance GPU/CPU cold plates
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    Single/Two phase immersion cooling system
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    Secondary Loop Accessories
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    Prefabricated Cooling Systems
Product Applications
  • Global Al Cloud Provider

    Deployed 250MW+ liquid cooling solution across multiple data centers

  • National University of Singapore

    Deployed our two-phase cooling at the Sustainable Tropical Data Centre Testbed ( STDCT ) to demonstrate what's possible for next-generation AI model training in tropical conditions.